Hot-pressed hexagonal boron nitride rods have shown extensive application potential in aerospace, electronics, metallurgy, and other fields due to their excellent high-temperature resistance, insulation, thermal conductivity, and corrosion resistance, providing important material support for the development of modern industry. In addition, for certain harsh service environments with structural and functional integration requirements, boron nitride rods are also an ideal candidate material.
This article mainly introduces the application of hexagonal boron nitride in multiple fields, including aerospace, metallurgy, electronics, and other fields:
1. Aerospace field
h-BN has high thermal stability and low dielectric loss and is one of the materials suitable for manufacturing high-temperature antenna covers/windows. Although it has problems such as low hardness and poor rain erosion resistance, using silicon nitride, silicon oxide, and other materials to composite h-BN ceramics, can improve the sintering characteristics while also combining the advantages of each component, and can meet the requirements of antenna covers/window components for heat protection, load bearing, wave transmission and other complex performances under high Mach number flight conditions {1}. For Hall electric thrusters that can be used for satellite and deep space probe attitude control, orbit insertion, transfer, and maintenance missions, the key component nozzle material is required to have good heat resistance, cyclic thermal shock resistance, high-temperature electrical insulation, ion sputtering erosion resistance, and suitable secondary electron emission coefficient. h-BN ceramics are the most suitable materials for preparing nozzle components.
2. Metallurgical industry
h-BN and its composite ceramics have been widely used as high-temperature refractory materials, such as TiB, -AIN-BN composite ceramic evaporation boats, SigN-BN separation rings, special metal high-temperature electrolytic cells, high-temperature collapses, casting shells, etc. With the deepening of research and the expansion of application needs, the performance of this series of ceramic materials has been greatly improved, and the application field has also been increasingly broadened.
Thin-strip continuous casting technology is a new thin-strip steel production process. Compared with the traditional hot rolling process, it has the advantages of less equipment investment, a simple production process, low energy consumption, and low product cost. The side sealing plate is an important leak-proof device added at both ends of the casting roll to form a molten pool of liquid metal between the casting rolls. It can restrain the metal liquid, promote the forming of the thin strip, and ensure the edge quality of the thin strip. It requires the material to have good thermal shock resistance, resistance to molten steel erosion, high-temperature volume stability, non-wetting with molten steel, and suitable wear resistance. After going through a variety of materials such as traditional refractory materials, fused quartz, and aluminum oxide.
3. Electronics industry
h-BN has high insulation and high thermal conductivity, and can be used as a heat dissipation management device in electronic circuits. When a single layer or a few layers of h-BN nanomaterials prepared by chemical vapor deposition or liquid phase exfoliation are applied to the surface of the chip, it can not only play a protective role, but also use its special two-dimensional structure to bring about excellent lateral heat transfer ability, quickly spread the local hot spot heat of high-power electronic devices horizontally, reduce the local maximum temperature, and thus improve the life and reliability of the device. In addition, h-BN powder is also an ideal polymer filler. Adding it to materials such as resin, rubber, and plastic can increase thermal conductivity and improve insulation properties, which plays an important role in the application of polymer materials in flexible electronic devices.
In recent years, with the increasing research on graphene, two-dimensional boron nitride nanosheets have also received widespread attention. Since the two have similar structures but different electrical properties, arranging them layer by layer can form a high-quality planar heterojunction, which has the characteristics of small lattice mismatch, high carrier mobility, and adjustable band gap width. It has broad application prospects in high-frequency transistors and optoelectronic devices with micro-nano structures.
4. Other application areas
h-BN also has a wide range of applications in other fields: boron-containing compounds have certain anti-neutron radiation properties, and h-BN can also be used for packaging materials to prevent neutron irradiation, structural components of atomic reactors, etc. h-BN’s high-temperature resistance, chemical stability, and good high-temperature lubrication properties make it.
Edgetech provides the Boron nitride ceramic products which have become indispensable in semiconductor aerospace, and high-temperature industrial applications due to their high-temperature stability, excellent electrical insulation, and good thermal management capabilities. Its design and material machinability make it particularly important in modern technology applications requiring high reliability and precise control. It provides customers with key support and guarantees to help them achieve improved production efficiency and optimized product performance.