Silicon carbide ceramic vacuum chuck is made of porous silicon carbide ceramic material, with uniform pore size distribution, interconnected inside, smooth and fine surface after grinding, and good flatness. It is widely used in the manufacturing process of semiconductor wafers such as silicon, sapphire, gallium arsenide, etc.
1. Working principle of ceramic vacuum chuck
Porous Ceramic Vacuum Chuck is a bearing platform that uses the principle of vacuum adsorption to fix the workpiece. The part of the vacuum chuck that transmits vacuum is a porous ceramic plate. The porous ceramic plate is assembled in the countersunk hole of the base, and its periphery is bonded and sealed with the base. The base is made of precision ceramic or metal material. By combining a metal or ceramic base and a special porous ceramic, the design of an internal precision airway, when negative pressure is applied, the workpiece can be smoothly and firmly adsorbed on the vacuum chuck
Because the holes of porous ceramic are very fine, the surface of the workpiece can be attached to the vacuum chuck without causing surface scratches, depressions and other adverse factors due to negative pressure.
2. Characteristics of ceramic vacuum suction cups
The structure is dense and uniform. The microporous ceramic material has a dense and uniform structure. It is not easy to absorb silicon powder and grinding debris, and the suction cup is easy to clean;
High strength, good wear resistance, with ceramic hardness, wear resistance, not easy to scratch and damage, no deformation during grinding, ensuring that the silicon wafer is evenly stressed at each point during grinding, and not easy to produce edge collapse, fragments and other phenomena;
Long service life, good surface shape retention, long dressing cycle and small dressing amount, so it has a high service life;
High insulation, insulating material, eliminate static electricity.
Reusable, easy to trim, no cracking, fragmentation, threshing and other phenomena will occur during trimming. After trimming and grinding, it can be used repeatedly within a certain degree.
Not easy to decompose and generate dust, ceramics are completely sintered, the structure is strong and stable, and no dust is generated.
Lightweight, lightweight material and internal structure are uniform pores, extremely light weight;
Good chemical stability, through material selection and process control, it can be made into porous ceramic suction cups suitable for various corrosive environments.
3. Ceramic vacuum chuck VS traditional metal chuck
The traditional metal chuck has uneven adsorption force, thin materials are easily deformed, and do not have an anti-static function. The material hardness is low and easy to wear. Ceramic vacuum chuck is suitable for thin parts adsorption, has anti-static function, wear resistance and corrosion resistance.
Application of ceramic vacuum chuck in semiconductor field
Ceramic vacuum chuck is a tool for clamping and carrying in semiconductor wafer production. It has high flatness and parallelism, dense and uniform structure, high strength, good air permeability, uniform adsorption force, and easy trimming. It is suitable for thinning, cutting, grinding, cleaning, and processing processes in semiconductor wafer manufacturing. It effectively solves many problems such as wafer imprint, chip electrostatic breakdown, particle pollution, etc., and achieves extremely high processing quality of semiconductor wafers in practical applications.
Edgetech can provide a variety of silicon carbide precision machined parts such as tubes, washers, insulators, rods, flanges, and other high-strength ceramic parts to meet customers’ customized requirements.