In modern semiconductor manufacturing processes, wafers are processed in multiple steps and need to be transferred back and forth between hundreds of process equipment. A device is therefore needed to hold the wafer. The Electrostatic Chuck (ESC) uses a pressure plate with integrated electrodes. These electrodes are biased by high voltage to generate electrostatic holding force between the pressure plate and the wafer. The wafer is clamped and fixed through an Electrostatic Chuck. The adsorption force is uniform and stable, and the wafer will not warp. Deformation can ensure the processing accuracy and cleanliness of the wafer. AlN ceramics have high thermal conductivity and insulation properties, making them suitable for use as ESC materials. We offer custom aluminum nitride electrostatic chuck.

Aluminum Nitride Ceramic Parameter

Item

Unit

Value

Color

–

Grayish white, Beige

Water absorption

%

0

Volume Density

g/cm3

≥3.30

Surface roughness

um

0.2-0.85

Warpage

(length ‰)

≤2.5‰

Thermal conductivity

W/m.k

≥170

Thermal expansivity

x 10-6/°C (20℃-800℃)

4-6

Flexural strength

MPa

≥350

Modulus of elasticity

GPa

310-320

Dielectric constant

1MHZ, 25℃

8.9

Dielectric loss

x 10-4

4.6

Dielectric strength

KV/mm

≥15

Volume resistivity

Ω.cm

≥1014

Typical characteristic

-Very high thermal conductivity

-High insulation capacity

-Low dielectric constant, effective against electronic signal interference

-Low thermal expansion

-Good metallization capacity

-Expansion coefficient can be matched with semiconductor silicon wafer

-Better mechanical strength than alumina

-Good corrosion resistance to molten metal

-Minimum impurity content, non-toxic, high purity

Application

Ceramic electrostatic chucks for the semiconductor industry

Packing

Our Aluminum Nitride Electrostatic Chuck is carefully handled to prevent damage during storage and transportation and to preserve the quality of our product in its original condition.