Aluminum nitride is a highly thermally conductive dielectric insulator ceramic. It provides the same high thermal and electrical properties as beryllium oxide at a more economical cost and without toxicity issues. When it comes to providing good thermal conductivity and high electrical insulation capabilities, aluminum nitride plate is an excellent choice due to their efficacy. The thermal expansion coefficient and isolation coefficient of aluminum nitride ceramic substrates are closely related to silicon products, making them very useful in electronic applications where high temperature and heat dissipation are a concern.

Aluminum Nitride Ceramic Parameter

Item

Unit

Value

Color

Grayish white, Beige

Water absorption

%

0

Volume Density

g/cm3

≥3.30

Surface roughness

um

0.2-0.85

Warpage

(length ‰)

≤2.5‰

Thermal conductivity

W/m.k

≥170

Thermal expansivity

x 10-6/°C (20℃-800℃)

4-6

Flexural strength

MPa

≥350

Modulus of elasticity

GPa

310-320

Dielectric constant

1MHZ, 25℃

8.9

Dielectric loss

x 10-4

4.6

Dielectric strength

KV/mm

≥15

Volume resistivity

Ω.cm

≥1014

Typical characteristic

-Very high thermal conductivity, Ultra-high thermal conductivity ≥225W/m·k

-High insulation capacity

-Low dielectric constant, effective against electronic signal interference

-Low thermal expansion

-Good metallization capacity

-Expansion coefficient can be matched with semiconductor silicon wafer

-Better mechanical strength than alumina

-Good corrosion resistance to molten metal

-Minimum impurity content, non-toxic, high purity

Application of Aluminum Nitride Ceramics

It is used in insulation, and heat dissipation devices and is widely used in HBLED, optical communications, IGBT, power devices, TEC, and other fields.

Packing

Our Aluminum Nitride plate is carefully handled to prevent damage during storage and transportation and to preserve the quality of our product in its original condition.