The active metal brazing (AMB) process is a further development of DBC process technology. It is a method that uses a small amount of active elements contained in the filler metal to react with ceramics to produce a reaction layer that can be wetted by the liquid solder to connect ceramics and metals. At present, with the rapid development of power electronics technology, high-power device control modules on high-speed rail have created a huge demand for ceramic copper-clad laminates, the key material for IGBT module packaging. In particular, AMB ceramic substrates have gradually become mainstream applications.

Material: AlN/ZTA/Si3N4

Aluminum Nitride Ceramic Parameter

Item

Unit

Value

Color

Grayish white, Beige

Water absorption

%

0

Volume Density

g/cm3

≥3.30

Surface roughness

um

0.2-0.85

Warpage

(length ‰)

≤2.5‰

Thermal conductivity

W/m.k

≥170

Thermal expansivity

x 10-6/°C (20℃-800℃)

4-6

Flexural strength

MPa

≥350

Modulus of elasticity

GPa

310-320

Dielectric constant

1MHZ, 25℃

8.9

Dielectric loss

x 10-4

4.6

Dielectric strength

KV/mm

≥15

Volume resistivity

Ω.cm

≥1014

Typical characteristic

-Very high thermal conductivity, Ultra-high thermal conductivity ≥225W/m·k

-High insulation capacity

-Low dielectric constant, effective against electronic signal interference

-Low thermal expansion

-Good metallization capacity

-Expansion coefficient can be matched with semiconductor silicon wafer

-Better mechanical strength than alumina

-Good corrosion resistance to molten metal

-Minimum impurity content, non-toxic, high purity

Application of Aluminum Nitride Ceramics

Ceramic coppered substrate for packaging IGBT modules for electric vehicles and motor vehicles

Packing

Our AMB Ceramic Substrate is carefully handled to prevent damage during storage and transportation and to preserve the quality of our product in its original condition.