Silicon Nitride Molding Die is a kind of mold made of silicon nitride ceramic material, which has excellent wear-resistant performance and high-temperature resistance. The appearance of this kind of mold provides an effective solution to the traditional mold wear problem.

Silicon nitride Performance

Item

Unit

Si3N4

Type

Gas pressure sintered

Density

g/cm3

3.2-3.3

Color

Black, Grey

Young Modulus

GPa

300~320

Vickers Hardness

GPa

15 – 17

Compressive Strength

MPa

2200

Bending Strength

MPa

600-1000

Thermal Conductivity

W/m.K

20-30

Thermal Expansion

10-6/°C

3.2

Max. Working Temp.

°C

1200

Volume Resistivity

Ω ·cm

> 1014

Dielectric Constant

6

Dielectric Strength

kV/mm

12

Fracture toughness

MPa·m1/2

5.0-7.0

Advantage

-Can effectively improve production efficiency. Due to its excellent wear resistance, serious wear problems will not occur during long-term use, thereby reducing the frequency of mold replacement and improving production efficiency.

-Wear-resistant silicon nitride ceramic inner mold can reduce production costs. Traditional molds often need to be replaced frequently due to wear problems, which not only increases production costs but also affects production progress. The use of wear-resistant silicon nitride ceramic inner molds can effectively reduce these costs.

-Wear-resistant silicon nitride ceramic inner mold can improve product quality. Due to its wear resistance, less frictional heat is generated during the production process, thus reducing product quality losses

Application

Silicon Nitride Molding Dies are widely used in various industrial productions.

-In the ceramic industry, can be used to make ceramic products of various shapes and specifications;

-In the metal smelting industry, can be used to make various metal products;

-In the chemical industry, can be used to make various chemical equipment, etc.

In addition, Silicon Nitride Molding Dies can also be used in medical, aviation, military, and other fields, and their application prospects are very broad.

Packing

Silicon Nitride Molding Dies use appropriate outer boxes and internal buffer materials, and some components are also vacuum-packed.