Cu/Mo/Cu (CMC) is a sandwich composite consisting of a molybdenum core layer and two copper cladding layers. It has adjustable CTE, high thermal conductivity, and high strength. The compound is made through a process called bonding, which layers molybdenum and copper together like a sandwich.

Once stacked, it tightly bonds the exchange layers of copper and molybdenum until the desired thickness ratio is achieved. The thickness ratio depends on the thermal conductivity required by the customer. The result is an extremely unique and useful metal alloy that shares the physical and chemical properties of molybdenum and copper.

All types of copper/molybdenum/copper sheets can be stamped into components.

This material has the advantages of adjustable thermal expansion coefficient, high thermal conductivity, and excellent high-temperature resistance. The production process generally adopts processing methods such as rolling lamination, electroplating lamination, and explosion molding. Primarily used as extensions and thermal pathways on the bottom of heat sinks, lead frames, and multilayer printed circuit boards (PCBs).

Cu-Mo-Cu (CMC materials) Heat Sinks Specification:

Cu: Mo: Cu (Thick ratio)

Density (g/cc)

Coefficient of Thermal Expansion (10-6/K)

Thermal Conductivity (W/m·K), x-y direction

Thermal Conductivity (W/m·K), x-z direction


























Our advantages

-Large-size panels available

-Can be stamped into components

-The interface bonding force is very strong and can repeatedly resist 850°C thermal shock.

-Adjustable CTE matches semiconductor and ceramic materials

-High thermal conductivity


-Coating available, Nickle, Gold

Advantages Copper-Molybdenum-Copper | Molybdenum-Copper

Thermal Conductivity

These laminates have an adjustable coefficient of thermal expansion that can be associated with a range of semiconductor substrates and still maintain high thermal conductivity. In short, they are excellent heat sinks. Anything that generates a lot of heat can benefit from using a Cu-Mo-Cu heat sink. It uses a highly localized heat source and spreads the energy through the layers.

If the temperature rises above the melting point of copper (1982°F), the copper liquefies and acts as a coolant for the molybdenum core. This is a good quality when plating electronic and electrical components because it prevents overheating during the transmission of electrical signals.

Strong bond

Cu-Mo-Cu laminates are tightly bonded due to the roll bonding process. These tight bonds help improve the heat resistance of the composite and the components it protects. These laminates can repeatedly reach temperatures up to 1560°F (850°C) without consequence, making them ideal for microwave components or other parts that may be subject to constant and/or extreme temperatures.

Adjustable coefficient

Since the two metals have opposite coefficients of thermal expansion (copper has a high coefficient of thermal expansion and molybdenum has a low coefficient of thermal expansion), we can change the coefficient of the alloy so that it matches the coefficient of thermal expansion of the other materials it is paired with. This prevents a lot of stress damage that can occur when thermal coefficients don’t match.

When plating any type of electronics, it’s important to match thermal expansion to a given chip. Thermal mismatch can cause incompatibility between the chip and the heat sink and should be avoided. Fortunately, the thermal expansion can be matched by changing the ratio of molybdenum to copper.


They also have low resistance and high conductivity. This makes them suitable for silicon-based devices as well as area power devices. Copper provides good electrical conductivity and low resistance, and the inner layer of molybdenum provides a very low coefficient of thermal expansion.

High availability and workability

Molybdenum in its purest form has high hardness and is very brittle. These physical properties make it difficult to process. Copper, on the other hand, is much more ductile. The combination of the two makes the alloy significantly more flexible, allowing it to be used for machining or other parts that require heavy use and/or wear.


Finally, Cu-Mo-Cu laminates are nonmagnetic. This makes these parts useful when working with products that may contain small magnetic components that would otherwise be affected by magnetic charges. Due to their lack of magnetism, these copper-molybdenum composites are a common pairing in a variety of complex electronics.

Main uses of Cu-Mo-Cu (CMC) and MoCu materials


Because CMC is an excellent conductor of thermal energy, it is commonly used in many aerospace components that frequently experience high-temperature conditions. 

Some of these components include the nozzle guard, combustion chamber, and vacuum contacts. Many of these components can be found in jet engines and turbines.


Molybdenum-copper alloys are also frequently used in the defense industry. While it is most commonly used in missile components that are subject to high temperatures, it can also be used in range extenders for a variety of different weapons.


Due to Cu-Mo-Cu’s biocompatibility properties, it is commonly used in a variety of different medical tools and devices, such as surgical instruments or dental implants. Since the composite is also non-magnetic and highly conductive, it is also used in various medical electronics.

Cu50Mo50 sheet
Molybdenum Copper
MoCu and WCu Heat Sink
Cu/MoCu/Cu CPC

Edgetech Industries LLC offers premium quality pure molybdenum, TZM alloys, molybdenum-lanthanum, molybdenum-rhenium alloy shaped articles, and complex parts.

Pure Metal: Plate, Sheet, Strip, Disc, Ribbon, Tube, Rod, Bar, Wire, Crucible, Fasteners, Tailor-made articles. The above product series are also applicable to molybdenum alloys.

Alloys: TZM Alloy, Mo-La Alloy, Mo-Re Alloy

Composites: Copper Molybdenum, CMC, CPC, heat sink 

Customized parts can be customized according to drawings, please send your drawings to