Semiconductor devices such as power transistors and optoelectronic devices such as lasers and light-emitting diodes (LEDs) have insufficient heat dissipation capabilities to regulate their temperatures. Radiators are designed to maximize the surface area in contact with the cooling medium (such as air) around them. 
Air flow rate, material selection, protruding design, and surface treatment are factors that affect radiator performance. MoCu and WCu materials (molybdenum copper and tungsten copper composite materials) are widely used in radiators due to their good thermal conductivity and thermal expansion coefficient, and the price is lower than GaN and SiN radiators.
We provide a variety of customized heat sink materials, including molybdenum copper, tungsten copper, CMC, and CPC, which can be plated with nickel or gold upon request
Properties for heat sink by copper molybdenum and copper tungsten.
Composites of heat sink | W88Cu | W85Cu | W80Cu | Mo90Cu | Mo88Cu | Mo85Cu | Mo20Cu |
Coefficient of Thermal Expansion (10-6/K) | 5.57 | 5.7 | 6.76 | 5.60 | 5.75 | 5.95 | 6.98 |
Thermal Conductivity (W/m·K) | 188 | 196 | 220 | 160 | 170 | 187 | 215 |
Heat sink size | 2”,4” diameter x Thickness, with gold and other coatings | ||||||
Besides MoCu and WCu heat sinks, we can also provide pure molybdenum, Cu-Mo-Cu, Cu-MoCu-Cu parts
Cu-Mo-Cu Heat Sinks Specification:
Cu: Mo: Cu (Thick ratio) | Density (g/cc) | Coefficient of Thermal Expansion (10-6/K) | Thermal Conductivity (W/m·K), x-y direction | Thermal Conductivity (W/m·K), x-z direction |
1:1:1 | 9.4 | 9.4 | 300~310 | 240~250 |
1:2:1 | 9.6 | 7.7 | 260~270 | 210~220 |
1:3:1 | 9.7 | 6.9 | 230~240 | 190~200 |
1:4:1 | 9.8 | 6.2 | 210~220 | 170~180 |
13:74:13 | 9.9 | 5.8 | 190~200 | 160~170 |
Cu-Mo70Cu-Cu Heat Sinks Specification:
Cu-Mo70Cu-Cu | Density (g/cc) | Coefficient of Thermal Expansion (10-6/K) | Thermal Conductivity (W/m·K) | ||
Plate direction | Thick direction | Plate direction | Thick direction | ||
1:4:1 | 9.46 | 7.2 | 9.0 | 250-300 | 210-250 |
ETI provides complete service for copper tungsten, copper molybdenum, pure molybdenum, Cu-Mo-Cu and Cu-Mo70Cu-Cu heat sinks. Send your request to sales@edge-techind.com.
Edgetech Industries LLC offers premium quality pure molybdenum, TZM alloys, molybdenum-lanthanum, molybdenum-rhenium alloy shaped articles, and complex parts.
Pure Metal: Plate, Sheet, Strip, Disc, Ribbon, Tube, Rod, Bar, Wire, Crucible, Fasteners, Tailor-made articles. The above product series are also applicable to molybdenum alloys.
Alloys: TZM Alloy, Mo-La Alloy, Mo-Re Alloy
Composites: Copper Molybdenum, CMC, CPC, heat sink
Customized parts can be customized according to drawings, please send your drawings to sales@edge-techind.com.