Semiconductor devices such as power transistors and optoelectronic devices such as lasers and light-emitting diodes (LEDs) have insufficient heat dissipation capabilities to regulate their temperatures. Radiators are designed to maximize the surface area in contact with the cooling medium (such as air) around them. Air flow rate, material selection, protruding design, and surface treatment are factors that affect radiator performance. MoCu and WCu materials (molybdenum copper and tungsten copper composite materials) are widely used in radiators due to their good thermal conductivity and thermal expansion coefficient, and the price is lower than GaN and SiN radiators.

We provide a variety of customized heat sink materials, including molybdenum copper, tungsten copper, CMC, and CPC, which can be plated with nickel or gold upon request

Properties for heat sink by copper molybdenum and copper tungsten.

Composites of heat sink

W88Cu

W85Cu

W80Cu

Mo90Cu

Mo88Cu

Mo85Cu

Mo20Cu

Coefficient of Thermal Expansion (10-6/K)

5.57

5.7

6.76

5.60

5.75

5.95

6.98

Thermal Conductivity (W/m·K)

188

196

220

160

170

187

215

Heat sink size

2”,4” diameter x Thickness, with gold and other coatings

Besides MoCu and WCu heat sinks, we can also provide pure molybdenum, Cu-Mo-Cu, Cu-MoCu-Cu parts

Cu-Mo-Cu Heat Sinks Specification:

Cu: Mo: Cu (Thick ratio)

Density (g/cc)

Coefficient of Thermal Expansion (10-6/K)

Thermal Conductivity (W/m·K), x-y direction

Thermal Conductivity (W/m·K), x-z direction

1:1:1

9.4

9.4

300~310

240~250

1:2:1

9.6

7.7

260~270

210~220

1:3:1

9.7

6.9

230~240

190~200

1:4:1

9.8

6.2

210~220

170~180

13:74:13

9.9

5.8

190~200

160~170

Cu-Mo70Cu-Cu Heat Sinks Specification:

Cu-Mo70Cu-Cu
(Thick ratio)

Density (g/cc)

Coefficient of Thermal Expansion (10-6/K)

Thermal Conductivity (W/m·K)

Plate direction

Thick direction

Plate direction

Thick direction

1:4:1

9.46

7.2

9.0

250-300

210-250

ETI provides complete service for copper tungsten, copper molybdenum, pure molybdenum, Cu-Mo-Cu and Cu-Mo70Cu-Cu heat sinks. Send your request to sales@edge-techind.com.

MoCu Parts
Molybdenum Copper
7I4A9626
Cu/MoCu/Cu CPC
7I4A9542
Cu/Mo/Cu CMC

Edgetech Industries LLC offers premium quality pure molybdenum, TZM alloys, molybdenum-lanthanum, molybdenum-rhenium alloy shaped articles, and complex parts.

Pure Metal: Plate, Sheet, Strip, Disc, Ribbon, Tube, Rod, Bar, Wire, Crucible, Fasteners, Tailor-made articles. The above product series are also applicable to molybdenum alloys.

Alloys: TZM Alloy, Mo-La Alloy, Mo-Re Alloy

Composites: Copper Molybdenum, CMC, CPC, heat sink 

Customized parts can be customized according to drawings, please send your drawings to sales@edge-techind.com.